Author:
Yang Kai-Shing,Lin Chen-Chuan,Shyu Jin-Cherng,Tseng Chih-Yung,Wang Chi-Chuan
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference17 articles.
1. http://www.digitimes.com.tw/tw/dt/n/shwnws.asp?cnlid=13&cat=20&id=0000313143_FPK0CNTD50PRFD2G9R2H0&ct=1, in.
2. Thermal effects in packaging high power light emitting diode arrays;Christensen;Appl. Therm. Eng.,2009
3. Thermal analysis of LED array system with heat pipe;Kim;Thermochim. Acta,2007
4. H. Zhong, C. Zhong, W. Mingguang, Heat dissipation for LED lighting: vapor chamber substrate printed circuit board, in: 2010 the 5th IEEE Conference on Industrial Electronics and Applications (ICIEA), 2010, pp. 565–570.
5. Experimental investigation of a flat plate heat pipe performance using IR thermal imaging camera;Boukhanouf;Appl. Therm. Eng.,2006
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