1. J. Walko, IBM looks to liquid jet-impingement for chip cooling, DOI: 05/24/2006 8:48 AM EDT, web content, .
2. State of the art of high heat flux cooling technologies;Agostini;Heat Transfer Eng.,2007
3. High performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
4. High-Output Power Control Unit, web content, .
5. S. A. Rogers, Annual Progress Report for the Advanced Power Electronics and Electric Machinery Program, 2007 Annual Progress Report, Vehicle Technologies Program, US DOE, December 2007.