Author:
Tran Ngoctan,Chang Yaw-Jen,Wang Chi-Chuan
Funder
Ministry of Science Technology of Taiwan
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference42 articles.
1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Dev. Lett.,1981
2. Analysis of two-layered micro-channel heat sink concept in electronic cooling;Vafai;Int. J. Heat Mass Transf.,1999
3. Numerical investigation and sensitivity analysis of manifold microchannel coolers;Boteler;Int. J. Heat Mass Transf.,2012
4. Enhancement thermodynamic performance of microchannel heat sink by using a novel multi-nozzle structure;Tran;Int. J. Heat Mass Transf.,2016
5. S.U.S. Choi, A.J.A. Eastman, Enhance thermal conductivity of fluids with nanoparticles, in: ASME International Mechanical Engineering Congress & Exposition, ASME International Mechanical Engineering Congress & Exposition, 1995, pp. 12–17.
Cited by
32 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献