Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions

Published:2008-09 Issue:3 Volume:43 Page:469-480
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Sham Man-Lung,Kim Jang-Kyo,Park Joo-Hyuk

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference15 articles.

1. S.K. Iliev, in: Fourteenth IEEE SEMI-THERM Symposium, 1998, pp. 161–168.

2. T. Zhou, M. Hundt, C. Villa, R. Bond, T. Lao, in: Proc. 47th Electronic Components & Technology Conference (ECTC), 1997, pp. 879–884.

3. T. Zhou, M. Hundt, in: Proc. NEPCON West, February, 1998, pp. 1139–1149.

4. Low Cost Flip Chip Technologies;Lau,2000

5. ANSYS Theory Reference, eleventh ed., SAS IP, Inc., 2002.

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review;Micromachines;2024-03-22

2. Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip;Journal of Electronic Packaging;2021-09-15

3. Multilayer CdHgTe-based infrared detector: 2D/3D microtomography, synchrotron emission and finite element modelling with stress distribution at room temperature and 100 K;Materialia;2020-03

4. Local Stress Analysis by XRD Single Crystal Method and Kossel Diffraction Applied to a Flip Chip Structure;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

5. Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process;Microelectronic Engineering;2016-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3