Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation-Reference-Cited by-同舟云学术

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Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

Published:2007-03 Issue:1 Volume:39 Page:187-197
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Gong Jicheng,Liu Changqing,Conway Paul P.,Silberschmidt Vadim V.

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference8 articles.

1. Tin–lead (SnPb) solder reaction in flip chip technology

2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

3. Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy

4. Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

5. Hibbitt, Karlsson, Sorensen, ABAQUS Analysis User’s Manual. Version 6.2, Pawtucket, Rhode Island, 2001.

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1. A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading;Materials;2023-06-19

2. Numerical investigation on Sn-rich solder joints failure mode: Effects of the thermomechanical anisotropic performance;Engineering Failure Analysis;2023-01

3. Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu: From β-Sn micropillars to polycrystals with intermetallics;Materials Science and Engineering: A;2022-10

4. A dual-phase crystal plasticity finite-element method for modeling the uniaxial deformation behaviors of thermally aged SAC305 solder;International Journal of Plasticity;2022-08

5. A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints;International Journal of Plasticity;2022-08

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