Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model
Author:
Publisher
Elsevier BV
Subject
Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science
Reference58 articles.
1. Direct resistance profile for an electrical pulse induced resistance change device
2. Pulsed-current duty cycle dependence of electromigration-induced stress generation in aluminum conductors
3. C. Basaran, Shidong Li, D.C. Hopkins, Wei Yao, Mean time to failure of SnAgCuNi solder joints under DC, in: Thirteenth IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.
4. Wei Yao, Cemal Basaran, Skin effect and material degradation of lead-free solder joint under AC. in: Thirteenth IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.
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