Author:
Wang Qi,Chen Kexin,Cao Wenbin
Reference49 articles.
1. Chung DDL. Thermal interface materials. Journal of Materials Engineering and Performance. 2001;10:56-59. DOI: 10.1361/105994901770345358
2. Chen H, Ginzburg VV, Yang J, Yang Y, Liu W, Huang Y, et al. Thermal conductivity of polymer-based composites: Fundamentals and applications. Progress in Polymer Science. 2016;59:41-85. DOI: 10.1016/j.progpolymsci. 2016.03.001
3. Afzal A, Siddiqi HM, Iqbal N, Ahmad Z. The effect of SiO2 filler content and its organic compatibility on thermal stability of epoxy resin. Journal of Thermal Analysis and Calorimetry. 2013;111:247-252. DOI: 10.1007/s10973-012-2267-9
4. Procter P, Solc J. Improved thermal conductivity in microelectronic encapsulants. In: Proceedings of the 41st Electronic Components & Technology Conference; 11-16 May 1991; Atlanta. New York: IEEE; 1991. pp. 835-842
5. Huang X, Jiang P, Tanaka T. A review of dielectric polymer composites with high thermal conductivity. IEEE Electrical Insulation Magazine. 2011;27:8-16. DOI: 10.1109/MEI.2011.5954064