Boron Doping in Next-Generation Materials for Semiconductor Device

Author:

Chi T. Cao Linh,Hakim Luqman,Hsu Shu-Han

Abstract

The article surveys the most recent achievements starting with the boron doping mechanism, mainly focused on doping in semiconductor materials such as Si, Ge, graphene, carbon nanotube, or other 2D materials. Frequently used doping methodologies are discussed, including ion implantation and solid-phase doping, mainly focused on recent developing techniques of monolayer doping. These doped materials’ structural, electronic, and chemical properties are addressed to understand the boron doping effect better. Theoretical and experimental information and data are used to support such atomic-level effects. Therefore, this review can provide valuable suggestions and guidelines for materials’ properties manipulation by boron doping for further research exploration.

Publisher

IntechOpen

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Boron Ion Implantation-Induced Embedded Layers for Ultra-Thin Die Structures;2023 IEEE Nanotechnology Materials and Devices Conference (NMDC);2023-10-22

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