A Systematic Study and Characterization of Advanced Corrosion Resistance Materials and Their Applications for Plasma Etching Processes in Semiconductor Silicon Wafer Fabrication-Reference-Cited by-同舟云学术

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A Systematic Study and Characterization of Advanced Corrosion Resistance Materials and Their Applications for Plasma Etching Processes in Semiconductor Silicon Wafer Fabrication

Published:2012-03-30 Issue: Volume: Page:
ISSN:
Container-title:Corrosion Resistance
language:
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Author:

Shih

Publisher

InTech

Link

http://www.intechopen.com/download/pdf/34479

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of plasma etching reactivity of bismuth aluminosilicate glasses using fluorine concentration;Journal of Non-Crystalline Solids;2024-04

2. Plasma resistant glass (PRG) for reducing particulate contamination during plasma etching in semiconductor manufacturing: A review;Materials Today Communications;2023-03

3. Advances of plant-extracted inhibitors in metal corrosion reduction – Future prospects and challenges;Results in Chemistry;2023-01

4. Analysis of Plasma Etching Reactivity of Bismuth Aluminosilicate Glasses Using Fluorine Concentration;2023

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