Ultrastructure of symbiotic germination of the orchid Dendrobium officinale with its mycobiont, Sebacina sp.

Author:

Chen J.,Wang H.,Liu S. S.,Li Y. Y.,Guo S. X.

Abstract

Dendrobium officinale is an endangered epiphytic orchidaceous medicinal plant. Similar to other orchid plants, the seed germination of D. officinale under natural conditions depends nutritionally upon mycorrhizal fungi. The compatible fungi have been isolated from D. officinale protocorms using in situ seed baiting technique in our previous studies. However, the interaction between seed germination of D. officinale and its mycobiont is still unclear. In the present study, we investigated the morphological changes of seed and fungus during the symbiotic germination using a light microscope and transmission electron microscope. Seeds of D. officinale have no conspicuous suspensor cells. The fungus enters into the embryo cell through the posterior end of the embryo and colonises the cortical cell in the first stage of germination (Stage 1). Then, the hyphae form pelotons with the protocorm development (Stages 1–3). After protocorm formation, the reinvaded fungal hyphae conspicuously decrease. Invaded hyphae lose bioactivity, form clumps and start degeneration at Stage 4 or 5 (seedling development). When penetrating the neighbouring cortical cell, the fungal hyphae constrict to collar shape at the contacted site and follow by swelling in the apex. Our study suggested that fungi trigger protocorm development and concomitant reserve utilisation during the symbiotic germination.

Publisher

CSIRO Publishing

Subject

Plant Science,Ecology, Evolution, Behavior and Systematics

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3