Copper Trace Adhesion Measurement Study for Advanced Substrate Circuitry Patterns-Reference-Cited by-同舟云学术

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Copper Trace Adhesion Measurement Study for Advanced Substrate Circuitry Patterns

Published:2023-04-19 Issue: Volume: Page:
ISSN:
Container-title:2023 International Conference on Electronics Packaging (ICEP)
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Author:

Chen Lisa Y.¹,Wang Tzu-Hsuan²,Deng Yanchun³,Mokhtar Iqbal⁴,Martell Steven R.⁵,Tsuriya Masahiro⁶

Affiliation:

1. Intel Corporation,Chandler,AZ,USA,85226

2. Unimicron Technology Corporation,Taoyuan City,Taiwan R.O.C,333422

3. AT&S (Chongqing) Company Ltd,Yuzui Town, Chongqing,China,401133

4. Intel Corporation,Kedah,Malaysia,09090

5. Nordson T&I,Santa Clara,CA,USA,95054

6. International Electronics Manufacturing Initiative (iNEMI),Setagaya-ku, Tokyo,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129699.pdf?arnumber=10129699

Reference3 articles.

1. Peel Strength of Metal Clad Laminates, IPC-TM-650 Method 2.4.8,1994

2. Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adhesion Characterization of Redistribution Layer;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

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