Adhesion Characterization of Redistribution Layer-Reference-Cited by-同舟云学术

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Adhesion Characterization of Redistribution Layer

Published:2024-04-17 Issue: Volume:1 Page:57-58
ISSN:
Container-title:2024 International Conference on Electronics Packaging (ICEP)
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Author:

Lee Kor Oon¹,Martell Steven R.²,Wang Tzu-Hsuan³,Deng Yangchun⁴,Tsuriya Masahiro⁵

Affiliation:

1. Intel Corporation,Kedah,Malaysia,09090

2. Nordson T&I,Santa Clara,CA,USA,95054

3. Unimicron Technology Corporation,Taoyuan City,Taiwan,R.O.C,333422

4. AT&S (Chongqing) Company Ltd.,Yuzui Town, Chongqing,China,401133

5. International Electronics Manufacturing Initiative (iNEMI),Setagaya-ku, Tokyo,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535584.pdf?arnumber=10535584

Reference4 articles.

1. Copper Trace Adhesion Measurement Study for Advanced Substrate Circuitry Patterns

2. RDL Adhesion Study for Advanced Packages;Martell,2023

3. IEC 249–1 (1982) Base materials for printed circuits;Part 1: Test methods

4. Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.

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