Author:
Massa Samuel,Shahin David,Wathuthanthri Ishan,Drechsler Annaliese,Basantkumar Rajneeta
Cited by
3 articles.
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1. Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. FCPBGA C4 Abnormal Leadfree Solder Bump Prevention;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Development of Flip Chip Bonding Process on Silicon Interposer by Using Copper Pillar;Proceedings of the Eighth Asia International Symposium on Mechatronics;2022