Sintered Ag joints on copper lead frame TO220 by pressure sintering process with improved reliability and bonding strength

Author:

Chew Ly May,Schmitt Wolfgang,Nachreiner Jens,Schnee Daniel

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices;Journal of Electronic Packaging;2019-06-17

3. Silver Sintering;CIRP Encyclopedia of Production Engineering;2019

4. Silver Sintering;CIRP Encyclopedia of Production Engineering;2018-10-11

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