Author:
Syed-Khaja Aarief,Franke Jörg
Publisher
Springer Berlin Heidelberg
Reference21 articles.
1. Bai G (2005) Low temperature sintering of nanoscale silver paste for semiconductor. Doctoral thesis, Virginia Polytechnic Institute and State University, Blacksburg
2. Chew LM, Schmitt W, Nachreiner J (2017) Sintered Ag joints on copper lead frame TO220 by pressure sintering process with improved reliability and bonding strength. Power conversion intelligent motion Europe, pp 1421–1425
3. Chew LM, Schmitt W, Schwarzer C, Nachreiner J (2018) Micro-silver sinter paste developed for pressure sintering on bare Cu surfaces under air or inert atmosphere. In: IEEE 68th electronic components and technology conference
4. German RM (1985) Liquid phase sintering. Plenum Press, New York
5. Johnson DL (1978) Fundamentals of the sintering of ceramics. In: Palmour H, Davis RF, Hare TM (eds) Processing of crystalline ceramics. Materials science research, vol 11. Springer, Boston, pp 137–149