Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications

Author:

Kanitkar Abhijeet1,Chernobryvko Mykola1,Rossi Marco1,Ndip Ivan1,Braun Tanja1,Muller Friedrich1,Lang Klaus Dieter1,Wieland Marcel2,Goetze Christian2,Halim Saquib Bin2,Trewhella Jean2

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration, IZM,Berlin,Germany,13355

2. GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,Dresden,Germany,01109

Publisher

IEEE

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

2. A Comparative Analysis of Two Dielectric Extraction Methods of a PCB Material for D-Band Applications;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

3. Temperature Dependent RF Characterization of Thin-Film Polyimide for 5G mmWave Antenna-in-Package Modules;2022 16th European Conference on Antennas and Propagation (EuCAP);2022-03-27

4. Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System;Polymers;2021-12-28

5. The Impact of Ageing on the Dielectric Properties of Laminates for 79 GHz Automotive Radar;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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