Feasibility study on ultrafine-pitch Cu-Cu bonding using directed self-assembly (DSA)-Reference-Cited by-同舟云学术

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Feasibility study on ultrafine-pitch Cu-Cu bonding using directed self-assembly (DSA)

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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Author:

Murugesan M.,Fukushima T.,Mori K.,Hashimoto H.,Bea Jichel,Koyanagi M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7939938/7947387/07947440.pdf?arnumber=7947440

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cu-SiO₂ Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications;2021 IEEE International 3D Systems Integration Conference (3DIC);2021-10

3. X-ray computed tomography studies on directed self-assembly formed vertical nanocylinders containing metals for 3D LSI applications—characterization technique-dependent reliability issues;Japanese Journal of Applied Physics;2019-03-27

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