Low-temperature Cu-to-Cu direct bonding enabled by highly (111)- oriented and nanotwinned Cu-Reference-Cited by-同舟云学术

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Low-temperature Cu-to-Cu direct bonding enabled by highly (111)- oriented and nanotwinned Cu

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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Author:

Chen Chih,Juang Jing-Ye,Chang Shih Yang,Shie Kai Cheng,Li Yu Jin,Tu K. N.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8732272/8735102/08735125.pdf?arnumber=8735125

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cu-SiO₂ Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications;2021 IEEE International 3D Systems Integration Conference (3DIC);2021-10

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