Wide Bandwidth Current Sensor for Characterization of High Current Power Semiconductor Modules

Author:

Ziegler Philipp1,Stjepandic Franjo1,Ruthardt Johannes1,Marx Philipp1,Fischer Manuel1,Roth-Stielow Jorg1

Affiliation:

1. INSTITUTE FOR POWER ELECTRONICS AND ELECTRICAL DRIVES,University of Stuttgart,Stuttgart,Germany,70569

Publisher

IEEE

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Compact Magnetoresistance-Rogowski Hybrid Sensor for Multichip Online Current Sensing in Press-Pack Power Module;IEEE Transactions on Industrial Electronics;2024-09

2. A Current Monitoring Method for Wire-bonding Power Modules based on Magnetoresistance-Planar Rogowski Coil;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

3. On performance evaluation of high‐power, high‐bandwidth current measurement technologies for SiC switching devices;IET Power Electronics;2024-04-30

4. PCB-Integrated Pickup-Coil for Overcurrent Detection in High-Current, Paralleled GaN HEMTs;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25

5. Design and Development of Hybrid Current Sensors for Wide-Bandgap Power Electronics Applications;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25

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