Eva-CAM: A Circuit/Architecture-Level Evaluation Tool for General Content Addressable Memories
Author:
Affiliation:
1. University of Notre Dame,USA
2. Rochester Institute of Technology,USA
3. Zhejiang University,China
Funder
Semiconductor Research Corporation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9774496/9774497/09774572.pdf?arnumber=9774572
Reference12 articles.
1. An Ultra-Dense 2FeFET TCAM Design Based on a Multi-Domain FeFET Model
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3. Nvsim: A circuit-level performance, energy, and area model for emerging nonvolatile memory;dong;TCAD,2012
4. Analog content-addressable memories with memristors
5. NVSim-CAM
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