Monolithic 3D Integration of FeFET, Hybrid CMOS Logic and Analog RRAM Array for Energy-Efficient Reconfigurable Computing-In-Memory Architecture
Author:
Affiliation:
1. Tsinghua University,School of Integrated Circuits, ICFC, BNRist,Beijing,China,100084
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10185199/10185158/10185221.pdf?arnumber=10185221
Reference6 articles.
1. A compute-in-memory chip based on resistive random-access memory
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Area- and Power-Efficient Compute-in-Memory Macro Based on Oxide Semiconductor 2T0C eDRAM With Cell-System Co-Optimization;IEEE Transactions on Electron Devices;2024-09
2. Fully Integrated 3-D Stackable CNTFET/RRAM 1T1R Array as BEOL Buffer Macro for Monolithic 3-D Integration With Analog RRAM-Based Computing-in-Memory;IEEE Transactions on Electron Devices;2024-05
3. Analytical Release Voltage Model of Monolithic 3-D Integrated Nanoelectromechanical Memory Switches;IEEE Transactions on Electron Devices;2024-05
4. Monolithic 3-D Integration of Counteractive Coupling IGZO/CNT Hybrid 2T0C DRAM and Analog RRAM-Based Computing-In-Memory;IEEE Transactions on Electron Devices;2024-05
5. High-performance ferroelectric field-effect transistors with ultra-thin indium tin oxide channels for flexible and transparent electronics;Nature Communications;2024-03-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3