Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology
Author:
Affiliation:
1. Fraunhofer Institute for Reliability and Microintegration,IZM,Berlin,Germany,13355
2. Technische Universität Berlin,Berlin,Germany,10623
3. GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,Dresden,Germany,01109
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9253686/9253732/09253926.pdf?arnumber=9253926
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications;2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP);2024-06-02
2. Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications;Electronics;2024-02-22
3. 3D Mold Embedded PCB-based MIMO Antenna Arrays for 79 GHz Automotive RADAR;2023 20th European Radar Conference (EuRAD);2023-09-20
4. FOStrip Technique for Low-Cost Fan-Out Package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
5. 3D Freeform Antenna-in-Package Approach for FOWLP;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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