Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology

Author:

Le Thi Huyen1,Kanitkar Abhijeet1,Rossi Marco1,Ndip Ivan1,Braun Tanja1,Mueller Friedrich2,Lang Klaus Dieter1,Wieland Marcel3,Goetze Christian3,Halim Saquib Bin3,Trewhella Jean3

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration,IZM,Berlin,Germany,13355

2. Technische Universität Berlin,Berlin,Germany,10623

3. GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,Dresden,Germany,01109

Publisher

IEEE

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications;2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP);2024-06-02

2. Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications;Electronics;2024-02-22

3. 3D Mold Embedded PCB-based MIMO Antenna Arrays for 79 GHz Automotive RADAR;2023 20th European Radar Conference (EuRAD);2023-09-20

4. FOStrip Technique for Low-Cost Fan-Out Package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. 3D Freeform Antenna-in-Package Approach for FOWLP;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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