Cu Pillar Planarization to Enhance Thermosonic Flipchip Bonding
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9584450/9584941/09584966.pdf?arnumber=9584966
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level Package;Sensors;2024-08-09
2. Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. 3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies;ECS Journal of Solid State Science and Technology;2023-08-01
4. A Comparison Between Pressure-less and Pressure-assisted Cu Sintering for Cu Pillar Flip Chip Bonding;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10
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