Significant consumption of Ni-P layer in Ni-P/Sn-0.7Cu solder joints during thermomigration
Author:
Affiliation:
1. Qualtec Co. Ltd.,Sakai,Osaka,Japan,590-0906
2. Jointing and Welding Research Institute, Osaka University,Ibaraki,Osaka,Japan,567-0047
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129736.pdf?arnumber=10129736
Reference8 articles.
1. Key parameters for fast Ni dissolution during electromigration of Sn0.7Cu solder joint
2. Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin
3. Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits
4. Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints
5. Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints
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