Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging-Reference-Cited by-同舟云学术

Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging

Published:2023-04-19 Issue: Volume: Page:
ISSN:
Container-title:2023 International Conference on Electronics Packaging (ICEP)
language:
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Author:

Tsai Chin-Hao¹,Steiner Felix¹,Ishikawa Dai²,Kao C. Robert³,Blank Thomas¹

Affiliation:

1. Institute for Data Processing and Engineering, Karlsruhe Institute of Technology,Germany

2. Resonac Corporation, Ltd.,Inorganic Materials Research Dept.,Japan

3. National Taiwan University,Department of Materials Science and Engineering

Funder

National Science and Technology Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129697.pdf?arnumber=10129697

Reference5 articles.

1. GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging

2. Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties

3. Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment

4. Low Temperature Silver Sinter Processes on (EN) EPEAg Surfaces for High Temperature SiC Power Modules;blank;Proc 10th International Conference on Integrated Power Electronics Systems,2018

5. Evaluation of Ag sintering die attach for high temperature power module applications

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