Reliability Studies of Fully Integrated CMOS Power Amplifier on Thinned Substrate for Flexible Electronics
Author:
Affiliation:
1. University of Wisconsin-La Crosse,Department of Computer Science and Engineering,La Crosse,WI,USA
2. University of Washington,School of Engineering and Technology,Tacoma,WA,USA
3. Hanwha Phasor Ltd.,Cambridge,England, United Kingdom
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10288585/10288613/10289139.pdf?arnumber=10289139
Reference5 articles.
1. Radio frequency reliability studies of CMOS RF integrated circuits for ultra‐thin flexible packages
2. Thermal characterization and modeling of ultra-thin silicon chips
3. Fully integrated CMOS power amplifier using resistive current combining technique
4. Impact of wafer thinning on front-end reliability for 3D integration
5. Study of 3D process impact on advanced CMOS devices;la manna;2013 Eurpoean Microelectronics Packaging Conference (EMPC) EMPC,2013
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