Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/8370366/8374290/08374353.pdf?arnumber=8374353
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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