Author:
Chen William,Bottoms Bill
Cited by
23 articles.
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1. Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Optimization of the CMP process for direct wafer-to-wafer oxide bonding;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
5. Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05