Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding-Reference-Cited by-同舟云学术

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Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding

Published:2023-12-05 Issue: Volume: Page:493-497
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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Author:

Cheemalamarri Hemanth Kumar¹,Lir Ji¹,Lee Wen¹,Rao Vempati Srinivasa¹,Singh Navab¹

Affiliation:

1. Agency for Science, Technology and Research (A*STAR),Institute of Microelectronics,Singapore,117685

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457722.pdf?arnumber=10457722

Reference4 articles.

1. Heterogeneous Integration Roadmap: Driving Force and Enabling Technology for Systems of the Future

2. Cu-SiO2Hybrid Bonding

3. Direct Bonding of low Temperature Heterogeneous Dielectrics

4. Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages

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