Submillimeter-scale multimaterial terrestrial robots

Author:

Han Mengdi1ORCID,Guo Xiaogang23ORCID,Chen Xuexian4,Liang Cunman5ORCID,Zhao Hangbo67ORCID,Zhang Qihui8,Bai Wubin68ORCID,Zhang Fan3ORCID,Wei Heming9ORCID,Wu Changsheng6,Cui Qinghong1ORCID,Yao Shenglian610ORCID,Sun Bohan611,Yang Yiyuan12ORCID,Yang Quansan12ORCID,Ma Yuhang13ORCID,Xue Zhaoguo3ORCID,Kwak Jean Won612ORCID,Jin Tianqi3ORCID,Tu Qing14ORCID,Song Enming15,Tian Ziao16,Mei Yongfeng17ORCID,Fang Daining2ORCID,Zhang Haixia4,Huang Yonggang81218ORCID,Zhang Yihui3ORCID,Rogers John A.68121920ORCID

Affiliation:

1. Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China.

2. Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China.

3. Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China.

4. National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China.

5. Department of Electronic Engineering, The Chinese University of Hong Kong, New Territories, Hong Kong 999077, China.

6. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.

7. Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA.

8. Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.

9. Key Laboratory of Specialty Fiber Optics and Optical Access Networks, Joint International Research Laboratory of Specialty Fiber Optics and Advanced Communication, Shanghai University, Shanghai 200444, China.

10. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.

11. Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218, USA.

12. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.

13. School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China.

14. Department of Materials Science and Engineering, Texas A&M University, College Station, TX 77843, USA.

15. Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai 200433, China.

16. State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China.

17. Department of Materials Science, Fudan University, Shanghai 200433, China.

18. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.

19. Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.

20. Department of Neurological Surgery, Northwestern University, Evanston, IL 60208, USA.

Abstract

Robots with submillimeter dimensions are of interest for applications that range from tools for minimally invasive surgical procedures in clinical medicine to vehicles for manipulating cells/tissues in biology research. The limited classes of structures and materials that can be used in such robots, however, create challenges in achieving desired performance parameters and modes of operation. Here, we introduce approaches in manufacturing and actuation that address these constraints to enable untethered, terrestrial robots with complex, three-dimensional (3D) geometries and heterogeneous material construction. The manufacturing procedure exploits controlled mechanical buckling to create 3D multimaterial structures in layouts that range from arrays of filaments and origami constructs to biomimetic configurations and others. A balance of forces associated with a one-way shape memory alloy and the elastic resilience of an encapsulating shell provides the basis for reversible deformations of these structures. Modes of locomotion and manipulation span from bending, twisting, and expansion upon global heating to linear/curvilinear crawling, walking, turning, and jumping upon laser-induced local thermal actuation. Photonic structures such as retroreflectors and colorimetric sensing materials support simple forms of wireless monitoring and localization. These collective advances in materials, manufacturing, actuation, and sensing add to a growing body of capabilities in this emerging field of technology.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Artificial Intelligence,Control and Optimization,Computer Science Applications,Mechanical Engineering

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