Wrap-like transfer printing for three-dimensional curvy electronics

Abstract

Three-dimensional (3D) curvy electronics has wide-ranging application in biomedical health care, soft machine, and high-density curved imager. Limited by material properties, complex procedures, and coverage ability of existing fabrication techniques, the development of high-performance 3D curvy electronics remains challenging. Here, we propose an automated wrap-like transfer printing prototype for fabricating 3D curvy electronics. Assisted by a gentle and uniform pressure field, the prefabricated planar circuits on the petal-like stamp are integrated onto the target surface intactly with full coverage. The driving pressure for the wrapping is provided by the strain recovery of a prestrained elastic film triggered by the air pressure control. The wrapping configuration and strain distribution of the stamp are simulated by finite element analysis, and the pattern and thickness of the stamps are optimized. Demonstration of this strategy including spherical meander antenna, spherical light-emitting diode array, and spherical solar cell array illustrates its feasibility in the development of complex 3D curvy electronics.