1. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
2. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
3. Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA.
4. Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.
5. The Ken&Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.
6. School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.
7. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
8. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
9. Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
10. School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.
11. Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.
12. School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, P. R. China.
13. Department of Engineering, University of Cambridge, Cambridge CB2 1PZ, UK.
14. Department of Neurosurgery, NorthShore University HealthSystem, Evanston, IL 60201, USA.
15. Department of Biomedical Engineering, University of Wisconsin-Madison, Madison, WI 53715, USA.
16. Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA.
17. Department of Electrical and Computer Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.
18. School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea.
19. Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China.
20. Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA.
21. Applied Mechanics Laboratory, Department of Engineering Mechanics; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China.
22. Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL 60607, USA.