Composition-matched molecular “solders” for semiconductors-Reference-Cited by-同舟云学术

Composition-matched molecular “solders” for semiconductors

Published:2015-01-23 Issue:6220 Volume:347 Page:425-428
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Dolzhnikov Dmitriy S.¹²,Zhang Hao¹²,Jang Jaeyoung¹²,Son Jae Sung¹²,Panthani Matthew G.¹²,Shibata Tomohiro³⁴,Chattopadhyay Soma³⁴,Talapin Dmitri V.¹²⁵

Affiliation:

1. Department of Chemistry, University of Chicago, Chicago, IL 60637, USA.

2. James Franck Institute, University of Chicago, Chicago, IL 60637, USA.

3. Materials Research Collaborative Access Team (MRCAT) Sector 10 Advanced Photon Source, Argonne National Laboratory, Argonne, IL 60439, USA.

4. Department of Physics, Advanced Materials Group, Illinois Institute of Technology, Chicago, IL 60616, USA.

5. Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA.

Abstract

Soldering semiconductor nanoparticles The optical and electronic properties of semiconductor nanoparticles can be tuned through changes in their size and composition. However, poor contact between interfaces can degrade nanoparticle performance in devices. Dolzhnikov et al. report the synthesis of a gel-like “solder” for metal chalcogenide nanoparticles, such as cadmium selenide and lead telluride, by cross-linking molecular wires of these materials. Science , this issue p. 425

Funder

NSF

U.S. Department of Energy

Keck Foundation

II-VI Foundation

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference46 articles.

1. Encyclop æ dia Britannica Online s. v. “soldering” (2014); available at www.britannica.com/EBchecked/topic/553118/soldering.

2. S. M. Sze Semiconductor Devices: Physics and Technology (John Wiley and Sons New York 2002).