Epitaxial lift-off of electrodeposited single-crystal gold foils for flexible electronics

Author:

Mahenderkar Naveen K.1ORCID,Chen Qingzhi2ORCID,Liu Ying-Chau2ORCID,Duchild Alexander R.2ORCID,Hofheins Seth2ORCID,Chason Eric3ORCID,Switzer Jay A.2ORCID

Affiliation:

1. Department of Materials Science and Engineering and Graduate Center for Materials Research, Missouri University of Science and Technology, Rolla, MO 65409, USA.

2. Department of Chemistry and Graduate Center for Materials Research, Missouri University of Science and Technology, Rolla, MO 65409, USA.

3. School of Engineering, Brown University, Providence, RI 02912, USA.

Abstract

Lifting off gold films A method for growing and removing single-crystal gold films can be used to create a flexible and transparent substrate for devices. Mahenderkar et al. grew gold films on the face of a silicon wafer and then used photoelectrochemistry to undergrow a sacrificial silicon dioxide layer. This layer allowed the gold film to be peeled off with adhesive tape. A 28-nm-thick gold foil showed a minimal increase in sheet electrical resistance after 4000 bending cycles. Flexible films of single-crystal cuprous oxide and of zinc oxide nanowires were then grown on the gold foils. Science , this issue p. 1203

Funder

U.S. Department of Energy

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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