STRENGTH PROPERTIES OF ELECTRON IRRADIATED FILMS OF NEGATIVE NOVOLAC
PHOTORESISTS ON MONOCRYSTALLINE SILICON
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Published:2023-10-31
Issue:2
Volume:
Page:35-41
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ISSN:2710-4230
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Container-title:HERALD OF POLOTSK STATE UNIVERSITY. Series С FUNDAMENTAL SCIENCES
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language:
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Short-container-title:HERALD OF POLOTSK STATE UNIVERSITY. Series С FUNDAMENTAL SCIENCES
Author:
VABISHCHEVICH S.1, VABISHCHEVICH N.1, BRINKEVICH D.2, PROSOLOVICH V.2, KOLOS V.3, ZUBOVA O.3
Affiliation:
1. Euphrosyne Polotskaya State University of Polotsk 2. Belarusian State University 3. “INTEGRAL” Joint Stock Company
Abstract
The adhesive and strength properties of electron-irradiated NFR 016D4 photoresist films for explosive lithography
deposited on the surface of KDB-10 single-crystalline silicon wafers by centrifugation have been studied.
It has been experimentally established that electron irradiation leads to warping and partial detachment of the
NFR 016D4 photoresist film from the silicon substrate. Irradiated photoresist films behave like brittle materials.
A significant decrease in crack resistance and adhesion to the silicon substrate of irradiated photoresist films was
observed. caused by radiation-induced processes at the photoresist/silicon interface.
Publisher
Polotsk State University
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