A Survey Addressing On-Chip Interconnect: Energy and Reliability Considerations

Author:

Postman Jacob1,Chiang Patrick1

Affiliation:

1. Department of Electrical Engineering and Computer Science, Oregon State University, Corvallis, OR 97331, USA

Abstract

Scaling CMOS process technology continues to enable increased levels of system integration, leading to on-chip communication demands beyond what traditional digital signaling techniques can efficiently provide with sufficient reliability. In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, energy, and reliability and provide a review of interconnect reliability considerations. Finally, we provide a case study to evaluate the efficiency of error correcting codes on a state-of-the-art energy-efficient low-swing interconnect.

Publisher

Hindawi Limited

Subject

General Engineering

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