Affiliation:
1. University of Parma, Department of Information Engineering, Parma, Italy
Abstract
paper reviews the activity carried out at the Department of Information
Engineering of the University of Parma, Italy, in the field of thermal and
electro-thermal modeling of devices, device and package assemblies, circuits,
and systems encompassing active boards and heat-sinking elements. This
activity includes: (i) Finite-Element 3D simulation for the thermal analysis
of a hierarchy of structures ranging from bare device dies to complex systems
including active and passive devices, boards, metallizations, and air- and
water-cooled heat-sinks, and (ii) Lumped-Element thermal or electro-thermal
models of bare and packaged devices, ranging from purely empirical to
strictly physics- and geometry-based.
Publisher
National Library of Serbia
Cited by
6 articles.
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