Through silicon via filling methods with metal/polymer composite for three-dimensional LSI
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/53/i=6S/a=06JH01/pdf
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1. Current Status of Research and Development for Three-Dimensional Chip Stack Technology
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3. Through-Silicon Via (TSV)
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