A new Cu(GeNx) alloy film for industrial applications
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/53/i=11S/a=11RC05/pdf
Reference33 articles.
1. Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates
2. Alteration of Cu conductivity in the size effect regime
3. Interfacial reaction issues for lead-free electronic solders
4. Interfacial reaction studies on lead (Pb)-free solder alloys
5. Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A new Cu(TiBN x ) alloy film for boosting the per-watt illuminance of high power LEDs;Japanese Journal of Applied Physics;2016-12-12
2. New Cu(TiBNx) copper alloy films for industrial applications;Japanese Journal of Applied Physics;2016-05-18
3. New Cu(AuTiNx) copper alloy film and its features;Japanese Journal of Applied Physics;2015-12-01
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