Impact of semiconductor on diamond structure for power supply on chip applications-Reference-Cited by-同舟云学术

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Impact of semiconductor on diamond structure for power supply on chip applications

Published:2014-01-01 Issue:4S Volume:53 Page:04EP16
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Nakagawa Kentaro,Kodama Takuya,Matsumoto Satoshi,Yamada Takatoshi,Hasegawa Masataka,Nishizawa Shinichi

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference30 articles.

1. Nanocrystalline diamond film growth on plastic substrates at temperatures below100 °Cfrom low-temperature plasma

2. Design guideline of a thin film SOI power MOSFET for high thermal stability

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of silicon-on-diamond substrate with an ultrathin SiO2 bonding layer;Japanese Journal of Applied Physics;2018-05-17

2. Reduced operating temperature of active layer Si covered by nanocrystalline diamond film;Journal of Materials Science: Materials in Electronics;2016-08-23

3. Impact of three-dimensional stacking silicon on diamond substrate for the electrostatic discharge protection device;Japanese Journal of Applied Physics;2016-03-29

4. Impact of the silicon on diamond structure for high temperature switching applications;Japanese Journal of Applied Physics;2015-02-18

5. Erratum: “Impact of semiconductor on diamond structure for power supply on chip applications”;Japanese Journal of Applied Physics;2014-04-30

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