Theoretical study of fabrication of line-and-space patterns with 7 nm quarter-pitch using electron beam lithography with chemically amplified resist process: IV. Comparison with experimental results
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/55/i=5/a=056503/pdf
Reference32 articles.
1. Chemical amplification in the design of dry developing resist materials
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4. EUV resist materials design for 15nm half pitch and below
5. Evaluation of EUV resist performance with interference lithography towards 11 nm half-pitch and beyond
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2. Classification of lines, spaces, and edges of resist patterns in scanning electron microscopy images using unsupervised machine learning;Japanese Journal of Applied Physics;2022-05-01
3. Relationship between blurring factors and interfacial effects in chemically amplified resist processes in photomask fabrication;Japanese Journal of Applied Physics;2021-12-01
4. Theoretical study of interfacial effects on low-energy electron dynamics in chemically amplified resist processes of photomask fabrication;Japanese Journal of Applied Physics;2021-08-01
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