Combined surface-activated bonding technique for low-temperature hydrophilic direct wafer bonding
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/55/i=4S/a=04EC02/pdf
Reference30 articles.
1. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics
2. Wafer bonding for silicon‐on‐insulator technologies
3. Silicon‐to‐silicon direct bonding method
4. A Model of Low‐Temperature Wafer Bonding And Its Applications
5. Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO[sub 2]
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