Simulation study for lifetime distribution of middle-of-line time-dependent dielectric breakdown affected by global and local spacing variations
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/55/i=6S3/a=06JF02/pdf
Reference31 articles.
1. Reliability challenges for the 10nm node and beyond
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1. Optimal Accelerated Test Framework for Time-Dependent Dielectric Breakdown Lifetime Parameter Estimation;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2020-12
2. Applications of lifetime distribution functions with two shape parameters for reliability analysis in advanced interconnect technologies: a brief review;Japanese Journal of Applied Physics;2020-04-01
3. Bayesian inference of a lifetime distribution parameter on the time-dependent dielectric breakdown with clustering defects;Japanese Journal of Applied Physics;2019-07-01
4. A Comprehensive Time-Dependent Dielectric Breakdown Lifetime Simulator for Both Traditional CMOS and FinFET Technology;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2018-11
5. Statistical evaluation method for lifetime distribution in field-accelerated time-dependent dielectric breakdown using two-step probability plot and multilink test scheme;Japanese Journal of Applied Physics;2018-05-21
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