Opportunities of CMOS-MEMS integration through LSI foundry and open facility

Author:

Mita Yoshio,Lebrasseur Eric,Okamoto Yuki,Marty Frédéfic,Setoguchi Ryota,Yamada Kentaro,Mori Isao,Morishita Satoshi,Imai Yoshiaki,Hosaka Kota,Hirakawa Atsushi,Inoue Shu,Kubota Masanori,Denoual Matthieu

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. An Add-in Test Structure Chip to Unitedly Assess PVD Material Properties in University Open Nanotechnology Platform;2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS);2024-04-15

2. Damage Assessment Structure of Thermal-Annealing Post-Processing on CMOS LSIs;2023 35th International Conference on Microelectronic Test Structure (ICMTS);2023-03-27

3. A Hybrid Fuzzy Decision Model for Evaluating MEMS and IC Integration Technologies;Micromachines;2021-03-07

4. Displacement Analysis of the MEMS Device;Metallurgical and Materials Engineering;2020-09-02

5. Circularly polarized vacuum ultraviolet coherent light generation using a square lattice photonic crystal nanomembrane;Optica;2020-07-22

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