In-situ detection method for wafer movement and micro-arc discharge around a wafer in plasma etching process using electrostatic chuck wafer stage with built-in acoustic emission sensor-Reference-Cited by-同舟云学术

In-situ detection method for wafer movement and micro-arc discharge around a wafer in plasma etching process using electrostatic chuck wafer stage with built-in acoustic emission sensor

Published:2014-01-01 Issue:3S2 Volume:53 Page:03DC04
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kasashima Yuji,Tabaru Tatsuo,Yasaka Mitsuo,Kobayashi Yoshikazu,Akiyama Morito,Nabeoka Natsuko,Motomura Taisei,Sakamoto Shingo,Uesugi Fumihiko

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference37 articles.

1. Wafer level microarcing model in 90nm chemical-vapor deposition low-k via etch on 300mm silicon-on-insulator substrate

2. Detecting Arcing Events in Semiconductor Manufacturing Equipment

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