Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias
Author:
Funder
Agency for Science, Technology and Research
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/57/i=7S2/a=07MF01/pdf
Reference16 articles.
1. Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies
2. Dielectric Materials for Integrated Capacitors
3. Characterization and Modeling of Atomic Layer Deposited High-Density Trench Capacitors in Silicon
4. Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element
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