Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies
Author:
Affiliation:
1. Fraunhofer IZM, Berlin
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx5/6040/4285919/04285957.pdf?arnumber=4285957
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