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Modeling of thermomechanical changes of extreme-ultraviolet mask and their dependence on absorber variation

  • Published:2018-05-22 Issue:6S1 Volume:57 Page:06HA01
  • ISSN:0021-4922
  • Container-title:Japanese Journal of Applied Physics
  • language:
  • Short-container-title:Jpn. J. Appl. Phys.

Author:

Ban Chung-Hyun,Park Eun-Sang,Park Jae-Hun,Oh Hye-Keun

Funder

Ministry of Trade, Industry and Energy

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Overlay and CD uniformity variation due to wafer thermal deformation caused by EUV exposure;Japanese Journal of Applied Physics;2023-02-20

2. Removal behavior of Sn and Pb contaminants on EUV mask after EUV exposure;Photomask Technology 2022;2022-12-01

3. Possible extreme ultraviolet mask thermal deformation during exposure;Journal of Micro/Nanopatterning, Materials, and Metrology;2021-08-31

4. Reduced lifetime of EUV pellicles due to defects;Journal of Micro/Nanopatterning, Materials, and Metrology;2021-08-02

5. Thermomechanical stability evaluation of various pellicle structures with contaminant particles;Japanese Journal of Applied Physics;2021-03-08
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