Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning-Reference-Cited by-同舟云学术

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Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning

Published:2017-11-24 Issue:2S1 Volume:57 Page:02BD02
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Wang Chenxi,Xu Jikai,Zeng Xiaorun,Tian Yanhong,Wang Chunqing,Suga Tadatomo

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/57/i=2S1/a=02BD02/pdf

Reference18 articles.

1. Handbook of Wafer Bonding

2. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics

3. Extended-Nanofluidics: Fundamental Technologies, Unique Liquid Properties, and Application in Chemical and Bio Analysis Methods and Devices

4. Field Assisted Glass‐Metal Sealing

5. A Review of Hydrophilic Silicon Wafer Bonding

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1. Sufficient Hydroxylation Surface-Activation for Low-Temperature Glass/Glass Direct Bonding;2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA);2023-10-27

2. Recent progress on bumpless Cu/SiO₂ hybrid bonding for 3D heterogeneous integration;Microelectronics International;2022-12-27

3. Fundamental research on machining performance of diamond wire sawing and diamond wire electrical discharge sawing quartz glass;Ceramics International;2022-09

4. Hydrophilic direct bonding of GaN and Si substrates by wet treatments using H₂SO₄/H₂O₂ mixture and NH₃/H₂O₂ mixture;Japanese Journal of Applied Physics;2022-03-24

5. Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing;Advanced MEMS/NEMS Fabrication and Sensors;2021-10-13

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