Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration-Reference-Cited by-同舟云学术

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Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration

Published:2013-04-01 Issue:4S Volume:52 Page:04CB09
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Ito Yuka,Fukushima Takafumi,Lee Kang-Wook,Choki Koji,Tanaka Tetsu,Koyanagi Mitsumasa

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference31 articles.

1. Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

2. Future system-on-silicon LSI chips

3. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fundamentals of Solder Alloys in 3D Packaging;3D Microelectronic Packaging;2020-11-24

2. Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly;2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2020-04

3. Self-Assembly Technologies for FlexTrate™;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

4. Fundamentals of Solder Alloys in 3D Packaging;3D Microelectronic Packaging;2017

5. (Invited) Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration;ECS Transactions;2016-08-24

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